Gold Plated Circuit Board Recycling: Analysis of Gold Plated Circuit Board Recycling Equipment and Main Structures

Gold-plated circuit boards are a common component in electronic devices, also known as metallized circuit boards or metal substrates. It is a substrate with a metal coating used to support and connect electronic components to form electronic circuits. Metal coatings typically use precious metals such as gold and silver for gold plating to provide excellent conductivity and corrosion resistance.

1、 Gold plated circuit board recycling equipment waste

Gold-plated circuit boards can be found on various electronic devices. The following are some common devices and components that may contain gold plated circuit boards: 1. Computers and laptops: computer motherboards, graphics cards, Memory module and other components may contain gold plated circuit boards. 2. Mobile phones and tablets: The motherboard, screen driver circuits, and other components in mobile devices such as smartphones and tablets typically include gold-plated circuit boards. 3. TV and monitor: Main board, power board, control circuit and other parts of TV, Computer monitor and other equipment may contain gold plated circuit board. 4. Communication equipment: Network devices such as routers, switches, modems, and circuit boards in wireless communication equipment may contain gold-plated circuit boards. 5. Automotive electronic equipment: many electronic equipment in Hyundai Motor Company, such as in vehicle entertainment system, navigation system and security system, may include gold plated circuit boards.

2、 Analysis of the Structure of Gold-plated Circuit Board

The main structure of gold-plated circuit board includes the following parts: 1. Base plate: usually made of insulating materials, such as glass fiber reinforced epoxy resin (FR-4) or polyimide (PI). The substrate is the main body of the circuit board, used to provide support and mechanical strength. 2. Conductive layer: Cover the surface of the substrate with a conductive layer, usually made of copper material. The conductive layer will undergo chemical gold plating or electroplating processes to provide better conductivity and welding ability. 3. Solder resistance layer: A solder resistance layer is an insulation layer that covers a conductive layer, usually using green, red, or blue solder resistance paint. It can serve as a barrier, protect the circuit from external environmental interference, and provide a smooth welding area on the surface. 4. Gold plating layer: On the surface of the conductive layer, a layer of precious metals (such as gold and silver) is covered as a protective layer through chemical gold plating or electroplating processes. The gold plating layer of precious metals not only provides good conductivity, but also improves the corrosion resistance and reliability of circuit boards.

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